Radisys EMC-BP8 chassis

Product manual:

Radisys EMC-BP8 is a high-performance industrial chassis designed to support various computing and communication devices. Here are some of the main features and technical specifications of this chassis:
main features
Chassis design:
High density: designed to accommodate multiple modules and boards, supporting high-density system configurations.
Modularization: Supports modular components for easy expansion and upgrading.
Industrial grade: Adopting industrial grade design, suitable for use in harsh environments.
Cooling and heat dissipation:
Fan system: Equipped with efficient fans and cooling systems to ensure that the temperature inside the chassis remains within a safe range.
Heat dissipation channel: Optimized air circulation design helps effectively eliminate heat.
Scalability and Interface:
Expansion Slot: Provides multiple expansion slots for installing various expansion cards and modules.
Front panel interface: Equipped with front panel interfaces such as USB, Ethernet ports, etc., for easy access.
Structure and materials:
Durable material: Made of high-strength metal material, it has excellent resistance to vibration and impact.
Compact design: The design is compact, saving space while providing sufficient component capacity.
Technical specifications (may vary due to actual configuration)
Size and appearance:
Size: Meets standard chassis dimensions and is suitable for various installation environments.
Appearance: The chassis has a compact appearance and is suitable for rack or desktop installation.
Expansion slot:
PCIe Slot: Provides multiple PCIe expansion slots, supporting different types of expansion cards.
Other interfaces: Depending on the specific model, it may include multiple USB, network, and serial port interfaces.
Cooling system:
Number of fans: Equipped with multiple fans to support efficient heat dissipation.
Heat dissipation design: Optimized heat dissipation channels ensure stable system operation.

Product details picture:

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