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RADIOSYS EPC-26-0-0 CPU circuit board

Brand:RADISYS
Model:EPC-26-0-0
Product status: New/used
Shipping place: Xiamen, China
Warranty: 365 days
Structural form: Other (specific form may vary depending on application)
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Details

RADIOSYS EPC-26-0-0 CPU circuit board

Product manual:

The Radisys EPC-26-0-0 CPU circuit board is a central processing unit (CPU) circuit board designed for high-performance computing and industrial applications. This circuit board is designed to provide powerful computing power and stable performance, suitable for various embedded systems and industrial control applications. The following is detailed information about the CPU circuit board:
main features
High performance processing
Processor: Equipped with a high-performance central processing unit, capable of executing complex computing and data processing tasks.
Multi core design: It may adopt a multi-core processor design to support multi-threaded operations and efficient data processing.
Scalability
Memory Slot: Provides memory slots for installing RAM modules and supporting memory expansion to meet different application requirements.
Expansion Slot: Includes PCIe, PCI, and other expansion slots, allowing users to add additional functional modules and interfaces.
high reliability
Industrial standards: Designed to meet industrial standards and capable of stable operation in harsh environments.
Durability: Using high-quality materials and components to ensure long-term reliability and stability.
Rich interfaces
I/O interface: Provides multiple input/output interfaces, such as USB, Ethernet, serial port, etc., for easy connection with external devices.
Video output: may include VGA, HDMI and other video output interfaces for display and monitoring.
Efficient power management
Power module: Integrated with an efficient power management module to ensure stable power supply and distribution.
Protection function: including overcurrent, overheating and other protection functions to ensure the safe operation of the system.
Design flexibility
Size and Shape: Provides different size and shape options to adapt to different application scenarios and installation requirements.
Cooling system: may include fan interfaces or heat dissipation design to ensure effective cooling of the processor and other components.

Product details picture:


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