LAM 839-019090-611 electrostatic clamp

Product manual:

LAM 839-019090-611 is an electrostatic chuck (ESC) used in semiconductor manufacturing equipment, mainly for fixing and temperature control during wafer processing. The following are its characteristics and application areas:
Main features:
Electrostatic adsorption
Use electrostatic force to firmly fix the wafer and avoid damage caused by mechanical clamping.
Accurate temperature control
Built in heating and cooling system for precise control of wafer temperature.
high reliability
Designed for high vacuum and plasma environments, with long lifespan and stable performance.
Compatible with multiple sizes
Supports wafers of different sizes (such as 200mm, 300mm) to meet various process requirements.
Low Pollution
Made with high-purity materials to reduce wafer contamination.
quick response
Fast temperature regulation response speed, suitable for high-precision process requirements.
Easy to integrate
Design in accordance with semiconductor equipment standards for easy installation and maintenance.
Application areas:
Semiconductor Manufacturing
Used for processes such as etching, chemical vapor deposition (CVD), physical vapor deposition (PVD), etc.
Flat panel display manufacturing
Used for thin film deposition and etching in the production of liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs).
Manufacturing of solar cells
Used for thin film deposition and surface treatment of photovoltaic cells.
Optical Coating
Coating process for optical lenses and filters.
Research and Laboratory
Support research in materials science and semiconductor processes.

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