Brooks 02-169208-00 Wafer Processing Robot

Product manual:

Main features:
High precision handling:
The Brooks 02-169208-00 robot is capable of achieving micrometer level wafer positioning,
Ensure the accuracy of the wafer during transportation.
Its high-precision design meets the demand for minimal error tolerance in semiconductor manufacturing.
Its control system provides a smooth and stable motion path,
Thereby reducing the vibration of the wafer during transportation and lowering the risk of wafer damage.
Multi axis control and flexible operation:
Equipped with a multi axis control system, supporting free movement in multiple directions and angles.
Robots can easily perform complex movements such as translation, rotation, and tilt,
To meet the different import and export needs of various devices.
The flexible design enables it to operate freely in small or complex equipment arrangements, increasing the diversity of production line layouts.
Cleanroom compatible design:
The material and structural design of Brooks 02-169208-00 comply with strict standards for cleanrooms,
Having low particle generation and low pollution risk,
Suitable for long-term stable operation in a clean room environment, protecting wafers from contamination.
The dust-proof design and high durability materials enable it to operate in clean rooms and minimize interference with the environment.
Intelligent monitoring and self diagnosis:
Equipped with an intelligent monitoring system, it can monitor the handling and operation status in real time, and provide fault detection and diagnosis functions.
This self diagnostic function can help the operations team discover and solve problems in a timely manner, reducing the risk of unexpected downtime.
Modular design:
Designed with a modular structure, it is easy to integrate with other Brooks equipment or third-party wafer processing equipment.
Modular design facilitates expansion, upgrading, and maintenance, providing support for the flexibility of production lines.
This feature enables it to be configured and adjusted according to specific needs to meet the requirements of different wafer sizes or process flows.

Product details picture:

More related products:

HIRSCHMANN MS3124-4 Communication Module

Helmholz 700-600-CAN01 Communication Module

MOTOROLA 188987-008R Analog module

More product recommendations:

BENDER IRDH375B-435 绝缘检测仪

BENDER IRDH575B1W-435绝缘监测仪

BEIJER E1043触摸屏