Brooks 002-7391-11 wafer aligner

Product manual:

The Brooks 002-7391-11 wafer aligner is a critical equipment provided by Brooks Automation,
Specially designed for precise alignment of wafers in the semiconductor manufacturing process.
Wafer aligners play a crucial role in semiconductor processing, etching, photolithography, and other precision manufacturing processes,
Can ensure accurate positioning of wafers at various processing stages.
Main features and functions:
High precision alignment:
The Brooks 002-7391-11 wafer aligner provides extremely high positioning accuracy,
Be able to accurately align various shapes or marks on the crystal circle.
This is crucial for precision processes such as photolithography, etching, and thin film deposition,
It can ensure that each processing meets the required high-precision requirements.
Strong adaptability:
This device can accommodate multiple wafer sizes and types, typically suitable for alignment of 200mm (8 inches) and 300mm (12 inches) wafers,
Other sizes of wafers can also be supported according to demand. The design of wafer aligners is flexible and compatible with various wafer carriers and processing equipment.
Support multi station operation:
In some applications, wafer aligners support multi station operations and can accurately align multiple wafers simultaneously, improving production efficiency.
Multi station support can significantly improve the automation level of large-scale production lines.
High stability and durability:
The design of Brooks 002-7391-11 wafer aligner emphasizes stability and durability,
Especially in clean room environments and long-term operating conditions, it can maintain high efficiency,
Reduce malfunctions and maintenance costs. High quality mechanical components and materials ensure their stability in high-strength applications.
Accurate motion control:
Aligners are typically equipped with precision motion control systems,
Can ensure precise movement and alignment of the wafer during operation.
A precise motion control system can minimize the deviation of wafer position to the greatest extent possible.

Product details picture:

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