Applied Materials 0010-44213 Wafer Lift Assembly

Product manual:

The Applied Materials 0010-44213 wafer lift module is a critical component in semiconductor equipment, used to support wafer handling, lifting, and precise positioning. This type of component is commonly used in wafer processing systems such as chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, and etching equipment to ensure high precision and stability of the wafer during processing.
Product Overview
Model: 0010-44213
Brand: Applied Materials
Product type: Wafer lifting component
Main function: To achieve stable lifting, handling, and position adjustment of wafers inside semiconductor equipment, supporting precise process operations.
main features
High precision control:
Support sub micron level accuracy to ensure the reliability of wafer positioning.
Reduce the offset and damage of wafers during lifting or movement.
Durable materials:
Made of high-strength, low friction materials, resistant to high temperatures and corrosion, suitable for harsh semiconductor processing environments.
Extend the service life of components and reduce maintenance costs.
Strong stability:
Specially designed for high-frequency use, providing smooth lifting and lowering movements.
Suitable for various sizes of wafers (usually supporting 200mm and 300mm wafers).
Modular design:
Easy to integrate into semiconductor devices of various Applied Materials.
Support quick replacement and maintenance, reducing equipment downtime.
Strong compatibility:
Compatible with various wafer processing equipment from Applied Materials, such as Etch, PVD, CVD systems, etc.
technical parameter
Supporting wafer size: 200mm or 300mm wafers (depending on model and configuration).
Operating environment:
Temperature range: Resistant to high temperature environments, typically operating between 150 ° C and 450 ° C.
Vacuum compatibility: Supports operation under high vacuum conditions.
Material: Heat shock resistant ceramic or special alloy, surface treated with special coating to reduce particle formation.
Action control: Supports linear lifting or rotational motion, depending on device configuration.

Product details picture:

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